Microcrystalline phosphorus copper Nuggets are an electroplated copper anode material. The main component is copper, with a typical copper content of over 99.94%, and a phosphorus content ranging from 250 to 650 ppm. The products are mainly applied in the electroplated copper manufacturing fields such as PCB manufacturing, decoration and surface treatment, and the photovoltaic industry. Microcrystalline phosphorus copper nugget adopt the industry-leading fully automatic cold heading process to form the spheres in one step. Through microcrystallization treatment, microcrystalline phosphorus copper nugget with a grain size of less than 50 um are formed. The anode film (phosphorus copper film) shows better performance, effectively improving the application performance and reducing the unit copper consumption. Experiments have proved that microcrystalline phosphorus copper nuggets can achieve a reduction of more than 3% in the overall copper consumption.
Cu-phos Nuggets Application:
Microcrystalline phosphorus copper nuggets are mainly used for electroplating copper purposes, especially in acid electroplating copper, circuit boards, electroforming molds, and plate-making electroplating fields.
The microcrystalline phosphorus copper nuggets shrink in size as they dissolve without deforming. By increasing the anode area, the anode current is reduced, and the coating quality remains exactly the same. Copper anodes with a phosphorus content of 0.030-0.075% form a black film of moderate thickness, with a dense structure and strong adhesion, and are not prone to peeling. They are suitable for electronic circuit boards, especially high-tech multilayer circuit boards, which are indispensable important components of contemporary various electronic information equipment. And high-quality PCB phosphorus copper particle anodes are an important raw material for manufacturing advanced electronic circuit boards.
